发明名称 POLISHING METHOD AND POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a polishing method for polishing a substrate while preventing coarse particles from being discharged onto a polishing pad.SOLUTION: A polishing method for polishing a substrate comprises the steps of: causing a polishing liquid to pass through a filter 14 while increasing a physical quantity of the polishing liquid which is one of the flow rate of the polishing liquid and the pressure thereof until it reaches a predetermined set value; and polishing the substrate W on a polishing pad 1 while supplying, onto the polishing pad 1, the polishing liquid passed through the filter 14.
申请公布号 JP2015082602(A) 申请公布日期 2015.04.27
申请号 JP20130220327 申请日期 2013.10.23
申请人 EBARA CORP 发明人 WATANABE HIROMITSU;YAMAGUCHI KUNIAKI;OBATA ITSUKI;WADA TAKETAKA
分类号 H01L21/304;B24B37/00;B24B57/02 主分类号 H01L21/304
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