发明名称 |
POLISHING METHOD AND POLISHING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a polishing method for polishing a substrate while preventing coarse particles from being discharged onto a polishing pad.SOLUTION: A polishing method for polishing a substrate comprises the steps of: causing a polishing liquid to pass through a filter 14 while increasing a physical quantity of the polishing liquid which is one of the flow rate of the polishing liquid and the pressure thereof until it reaches a predetermined set value; and polishing the substrate W on a polishing pad 1 while supplying, onto the polishing pad 1, the polishing liquid passed through the filter 14. |
申请公布号 |
JP2015082602(A) |
申请公布日期 |
2015.04.27 |
申请号 |
JP20130220327 |
申请日期 |
2013.10.23 |
申请人 |
EBARA CORP |
发明人 |
WATANABE HIROMITSU;YAMAGUCHI KUNIAKI;OBATA ITSUKI;WADA TAKETAKA |
分类号 |
H01L21/304;B24B37/00;B24B57/02 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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