| 摘要 |
PROBLEM TO BE SOLVED: To protect an electronic component and substrate when a heat dissipation sheet is laminated on the electronic component arranged on the substrate and is fixed by being pressed in a substrate direction by using a member.SOLUTION: An electronic apparatus provided with an electronic component to be cooled which is arranged on a substrate includes: a heat dissipation sheet that contacts the electronic component and covers an entire upper surface of the electronic component; and a pressing part that contacts the heat dissipation sheet at a position which is inside the upper surface of the heat dissipation sheet and does not overlap with the electronic component, and presses the heat dissipation sheet in a substrate direction. The pressing part can be formed on a part of a metal component that is fixed on the substrate and covers an upper space of the substrate. |
