| 摘要 |
PROBLEM TO BE SOLVED: To achieve a semiconductor package which has less warpage and distortion and which achieves good heat radiation and ensures reliability.SOLUTION: In a semiconductor package, by using an alloy material of iron, nickel and cobalt, which has a linear thermal expansion coefficient relatively closer to that of ceramic as a material of a peripheral region 121 of a side wall of a frame body 12, which contacts a ceramic terminal 13, and by using a metallic material the same with that of a base plate 11 for a region 122 of the frame body 12 other than the region 121, a stress generated due to a difference in linear thermal expansion coefficients of materials of respective members at the time of fastening a package is reduced, and warpage and distortion after fastening of the package is reduced. |
