| 摘要 |
The present invention is a device and a method thereof configured to mount an elastic polymer band into a mounting groove around a semiconductor substrate support part used for supporting a semiconductor substrate within a plasma processing chamber, comprising an installated unit having an upper ring, a clamp ring and a base ring, wherein when the upper ring is tightening on the base ring, the elastic polymer band is clamped between a lower surface of the clamp ring and an upper surface of the base ring, and the base ring has a clamping surface configured so as to release the elastic polymer band on at least one of a lower surface of the clamp ring and/or an upper surface of the base ring. A latch and release mechanism releases the elastic polymer band to a mounting groove by de-clamping the elastic polymer band from a gap between the clamp ring and the base ring. |
