| 摘要 |
<p>The device has a multi-layer body including a semiconductor material that is attached to a substrate (102). A dielectric material layer (104) is provided between the semiconductor material and the substrate. A fluidic micro-channel is extended in a side direction through the dielectric material layer and the semiconductor material. An electric circuit is extended from interposition of an electrical contact on a main surface toward another electrical contact on another main surface of the device through the device. An independent claim is also included for a method for manufacturing a semiconductor structure.</p> |
