发明名称 |
METHOD FOR PRODUCING A LARGE NUMBER OF SUPPORT APPARATUSES WHICH CAN BE SURFACE-MOUNTED, ARRANGEMENT OF A LARGE NUMBER OF SUPPORT APPARATUSES WHICH CAN BE SURFACE-MOUNTED, AND SUPPORT APPARATUS WHICH CAN BE SURFACE-MOUNTED |
摘要 |
The invention specifies a method for producing a large number of support apparatuses which can be surface-mounted. The method comprises, in particular, the following steps: A) providing a support plate (10) with a first main face (11) and a second main face (12) which is situated opposite the first main face (11), B) applying an electrically conductive layer (2) to the first main face (11) of the support plate (10), C) applying a solder resist mask (30) to a side of the electrically conductive layer (2) which is averted from the support plate (10), wherein a large number of adjoining regions (3) is formed on the electrically conductive layer (2) by the solder resist mask (30), D) applying a solder material (4) to the solder resist mask (30) and the electrically conductive layer (2), wherein the solder resist mask (30) and the electrically conductive layer (2) are covered by the solder material (4) at least at points, E) separating the support plate (10) and the electrically conductive layer (2) along and through the solder resist mask (30) and the solder material (4), wherein the solder material (4) remains on the solder resist mask (30) at least at points. |
申请公布号 |
WO2015055247(A1) |
申请公布日期 |
2015.04.23 |
申请号 |
WO2013EP71720 |
申请日期 |
2013.10.17 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
LIM, CHOO KEAN;CHANG, CHEE JIA;OR, CHOON KEAT |
分类号 |
H01L33/48;H01L21/48;H01L23/00;H01L23/488;H05K3/00;H05K3/34 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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