发明名称 |
LED MODULE |
摘要 |
The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate. |
申请公布号 |
US2015108510(A1) |
申请公布日期 |
2015.04.23 |
申请号 |
US201314404092 |
申请日期 |
2013.05.24 |
申请人 |
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
发明人 |
Urano Yoji;Nakamura Akifumi;Ioka Hayato;Imai Ryoji;Goda Jun;Hirano Toru;Suzuki Masanori;Hyuga Hideaki |
分类号 |
H01L25/075;H01L33/62;H01L33/48;H01L33/60;H01L33/50;H01L33/54 |
主分类号 |
H01L25/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Osaka JP |