发明名称 LED MODULE
摘要 The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.
申请公布号 US2015108510(A1) 申请公布日期 2015.04.23
申请号 US201314404092 申请日期 2013.05.24
申请人 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. 发明人 Urano Yoji;Nakamura Akifumi;Ioka Hayato;Imai Ryoji;Goda Jun;Hirano Toru;Suzuki Masanori;Hyuga Hideaki
分类号 H01L25/075;H01L33/62;H01L33/48;H01L33/60;H01L33/50;H01L33/54 主分类号 H01L25/075
代理机构 代理人
主权项
地址 Osaka JP