| 摘要 |
An apparatus for cooling a downhole device is provided that in one embodiment includes a refrigerant having a saturation vapor pressure and stored in a chamber, an outlet configured to allow the refrigerant to discharge from the chamber and vaporize to cool the downhole device, and a force application device configured to apply pressure on the refrigerant in the chamber to maintain the refrigerant in the chamber at or above the saturation vapor pressure of the refrigerant. In another aspect, a method of cooling a device is provided that in one embodiment includes providing a chamber containing a refrigerant therein, the refrigerant having a saturation vapor pressure, discharging the refrigerant from the chamber to cause the refrigerant to evaporate to cause a cooling effect proximate the device to be cooled, and maintaining the refrigerant at or above the saturation vapor pressure of the refrigerant. |
