发明名称 ELECTRODE PAD STRUCTURE
摘要 <p>PROBLEM TO BE SOLVED: To provide an electrode pad structure in which a highly accurate test can be achieved.SOLUTION: The electrode pad structure includes: an electrode pattern 16 formed on an insulating film 12 and having a connecting position 22 on a center part; a via hole 12a arranged in a region corresponding to the connecting position 22 of the insulating film 12; a signal wiring 14a located under the insulating film 12 and connected to the electrode pattern 16 through the via hole 12a; and hemispherical pads 18 arranged on the electrode pattern 16 and each having a surface on which distances up to the connecting portion 22 are substantially fixed from any positions of the upper surface.</p>
申请公布号 JP2015079892(A) 申请公布日期 2015.04.23
申请号 JP20130216829 申请日期 2013.10.17
申请人 SUMITOMO ELECTRIC IND LTD 发明人 ANEGAWA OSAMU
分类号 H01L21/3205;H01L21/60;H01L21/66;H01L21/768;H01L21/822;H01L23/522;H01L27/04 主分类号 H01L21/3205
代理机构 代理人
主权项
地址