| 发明名称 |
Electronic Component |
| 摘要 |
An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip includes a chip surface. One or both of the carrier surface and the chip surface include a non-planar structure. The chip is attached to the carrier with the chip surface facing towards the carrier surface so that a gap is provided between the chip surface and the carrier surface due to the non-planar structure of one or both of the carrier surface and the first chip surface. The electronic component further includes a first galvanically deposited metallic layer situated in the gap. |
| 申请公布号 |
US2015111343(A1) |
申请公布日期 |
2015.04.23 |
| 申请号 |
US201414581653 |
申请日期 |
2014.12.23 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Mahler Joachim;Mengel Manfred;Hosseini Khalil;Schmidt Klaus;Kalz Franz-Peter |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for fabricating an electronic component, the method comprising:
providing an electrically conductive carrier comprising a first carrier surface; providing a semiconductor chip comprising a first chip surface, wherein one or both of the first carrier surface and the first chip surface comprise a non-planar structure; attaching the semiconductor chip to the carrier with the first chip surface facing towards the first carrier surface so that a gap is provided between the first chip surface and the first carrier surface due to the non-planar structure of one or both of the first carrier surface and the first chip surface; and galvanically depositing a first metallic layer in the gap. |
| 地址 |
Neubiberg DE |
