| 发明名称 |
3DIC Packages with Heat Dissipation Structures |
| 摘要 |
A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a second portion not overlapped by the first die. A first Thermal Interface Material (TIM) is over and contacting a top surface of the first die. A heat dissipating lid has a first bottom surface contacting the first TIM. A second TIM is over and contacting the second portion of the second die. A heat dissipating ring is over and contacting the second TIM. |
| 申请公布号 |
US2015108631(A1) |
申请公布日期 |
2015.04.23 |
| 申请号 |
US201414579388 |
申请日期 |
2014.12.22 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Hung Wensen;Huang Szu-Po;Chen Kim Hong;Jeng Shin-Puu |
| 分类号 |
H01L23/367 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package comprising:
a die stack comprising a plurality of dies; a die underlying and bonded to the die stack, wherein the die comprises:
a first portion overlapped by the die stack; anda second portion not overlapped by the die stack; a first Thermal Interface Material (TIM) over and contacting a top surface of the die stack; a second TIM over and contacting the second portion of the die; and a heat dissipating lid comprising:
a first bottom surface contacting the first TIM; anda second bottom surface contacting the second TIM. |
| 地址 |
Hsin-Chu TW |
