发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED FILM AND PRODUCTION METHOD OF THE SAME, SEMICONDUCTOR ELEMENT, AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having a high film residual rate after development and excellent mechanical characteristics and thermal characteristics of a patterned cured film formed therefrom, and to provide a patterned cured film and a production method of the patterned cured film using the photosensitive resin composition, a semiconductor element having the patterned cured film as an interlayer insulating layer or a surface protective layer, and an electronic device having the semiconductor element.SOLUTION: The photosensitive resin composition comprises (A) an alkali-soluble resin having a predetermined structural unit, (B) a compound that generates an acid by light, (C) a thermal crosslinking agent, and (D) an acrylic resin having a predetermined structural unit.
申请公布号 JP2015079191(A) 申请公布日期 2015.04.23
申请号 JP20130217298 申请日期 2013.10.18
申请人 HITACHI CHEMICAL CO LTD 发明人 AOKI MASARU;MATSUTANI HIROSHI;KASUYA KEI
分类号 G03F7/023;C08F12/24;G03F7/004 主分类号 G03F7/023
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