发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED FILM AND PRODUCTION METHOD OF THE SAME, SEMICONDUCTOR ELEMENT, AND ELECTRONIC DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having a high film residual rate after development and excellent mechanical characteristics and thermal characteristics of a patterned cured film formed therefrom, and to provide a patterned cured film and a production method of the patterned cured film using the photosensitive resin composition, a semiconductor element having the patterned cured film as an interlayer insulating layer or a surface protective layer, and an electronic device having the semiconductor element.SOLUTION: The photosensitive resin composition comprises (A) an alkali-soluble resin having a predetermined structural unit, (B) a compound that generates an acid by light, (C) a thermal crosslinking agent, and (D) an acrylic resin having a predetermined structural unit. |
申请公布号 |
JP2015079191(A) |
申请公布日期 |
2015.04.23 |
申请号 |
JP20130217298 |
申请日期 |
2013.10.18 |
申请人 |
HITACHI CHEMICAL CO LTD |
发明人 |
AOKI MASARU;MATSUTANI HIROSHI;KASUYA KEI |
分类号 |
G03F7/023;C08F12/24;G03F7/004 |
主分类号 |
G03F7/023 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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