PRETREATMENT AGENT FOR ELECTROLYTIC COPPER PLATING, PRETREATMENT METHOD FOR ELECTROLYTIC COPPER PLATING, AND ELECTROLYTIC COPPER PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a pretreatment agent for electrolytic plating which does not impair adhesiveness between ground copper and a resist or adhesiveness between ground copper and an electrolytic copper plated film.SOLUTION: A method of pretreating a surface of a to-be-treated object having a resist pattern for circuit formation made by forming an electrolytic copper plated film on ground copper through electrolytic copper plating on which surface the circuit on the ground copper is to be formed is characterized by immersing the object having the ground copper in a pretreatment agent for electrolytic plating consisting of an aqueous solution comprising (A) 0.01-200 g/L of one or more adsorption inhibitors selected from triazole compounds, pyrazole compounds and imidazole compounds, (B) 0.01-200 g/L of chloride ion and (C) 0.1-200 g/L of a nonionic surfactant.