| 摘要 |
The invention relates to a method for producing an array (1) formed from a multiplicity of electric integrated circuits (la), said array being intended for separation and having a conductive connection to a central contact path for bond monitoring, said method comprising the following steps: applying conductive tracks (3 a) to the array, wherein the separation region (2) is recessed from applying said tracks (3a), closing the conductive connection to the central contact path by applying individual conductive connection portions (3), which extend between two contact paths (4) which enclose the separation region (2) and are arranged adjacent thereto, formed from at least one material from the group comprising the elements gold, palladium, tantalum and nickel and also comprising the alloy containing predominantly at least one of the mentioned elements. |
