发明名称 LIGHT/MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, AND ADHESIVE FOR DISPLAY DEVICE
摘要 <p>The purpose of the present invention is to provide a light/moisture-curable resin composition having excellent shape retention properties, adhesive properties, rapid curing properties and coating properties. In addition, the purpose of the present invention is to provide an adhesive for an electronic component and an adhesive for a display device, the adhesives being obtained using this light/moisture-curable resin composition. The present invention is a light/moisture-curable resin composition containing a radically polymerizable compound, a moisture-curable urethane resin, a photo-radical polymerization initiator and a filler.</p>
申请公布号 WO2015056717(A1) 申请公布日期 2015.04.23
申请号 WO2014JP77449 申请日期 2014.10.15
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 TAKAHASHI TORU;YUUKI AKIRA;KUNIHIRO YOSHITAKA;KIDA TAKUMI
分类号 C08G18/10;C08F2/44;C08F299/06;C08G18/67;C09J4/06;C09J11/04;C09J175/04 主分类号 C08G18/10
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