发明名称 System for controlling thermal conducivity of electronic parts housing
摘要 <p>The present invention relates to a device for controlling thermal conductivity of a housing for electronic parts that efficiently controls thermal conductivity of a housing having electronic parts inside thereof. The object of the present invention is to provide a device for controlling thermal conductivity of a housing for electronic parts that can variably control thermal conductivity of the housing by controlling orientations of insulative magnetic particles in a charging liquid filled inside the housing. Accordingly, the present invention provides the device for controlling thermal conductivity of the housing for electronic parts, comprising: a charging liquid filled inside a hollow space formed between an outer wall and an inner wall of the housing; and a magnetic field generating member mounted on an outer surface of the inner wall, wherein insulative magnetic particles are dispersed in the charging liquid, and orientations of the insulative magnetic particles change according to a direction of a magnetic field supplied by the magnetic field generating member.</p>
申请公布号 KR20150043733(A) 申请公布日期 2015.04.23
申请号 KR20130122480 申请日期 2013.10.15
申请人 发明人
分类号 G05D23/20;H01M10/60 主分类号 G05D23/20
代理机构 代理人
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