| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for producing and a method for adjusting a liquid resin composition for sealing which has less warpage at room temperature and in a soldering process by adding an effect of suppressing the warpage caused by thermal expansion difference between a semiconductor element and a substrate to the resin composition for sealing, has excellent heat dissipation, and is used for producing a semiconductor device by a method which reduces labor and cost for production; and a method for sealing the semiconductor device and the semiconductor element sealed by using the same. <P>SOLUTION: In the method for producing a liquid resin composition for sealing containing (A) a liquid epoxy resin, (B) a curing agent, and (C) an inorganic filler, the liquid resin composition for sealing is produced by mixing two or more liquid resin compositions for sealing. Each of the liquid resin compositions for sealing contains (A) a liquid epoxy resin, (B) a curing agent, and (C) an inorganic filler. In (C) the inorganic filler, the type of the main inorganic filler accounting for 70 wt.% or more of the total amount of the inorganic fillers differs among the respective liquid resin compositions for sealing. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
