Three-dimensional monolithic electronic-photonic integrated circuit

摘要

A three-dimensional monolithic electronic-photonic integrated circuit and a method of manufacturing the same. The electronic-photonic integrated circuit (200) may include a photonic element (260) formed in a sealed space of a substrate and an electronic element (270) formed on the substrate. The substrate may include a first substrate (210) and a second substrate (252) that are bonded to each other. The first substrate (210) having a first trench (212) corresponding to the sealed space formed therein, a first surface of the second substrate (252) having the photonic element formed thereon, and the sealed space defined by a space formed inside the first trench that is sealed by the first surface of the second substrate.