发明名称 レーザ加工装置
摘要 A laser marking apparatus is provided with a laser emission unit (13) that emits laser beam and a laser radiation unit (14) that is detachably connected to the laser emission unit (13). The laser radiation unit (14) radiates the laser beam emitted from the laser emission unit (13) toward an object to be processed. A projection (44), which projects rearward, is formed on a part of the laser radiation unit (14) that is connected with the laser emission unit (13). A recess (28) is provided in a part of the laser emission unit (13) that is connected with the laser radiation unit (14). The projection (44) can fit into the recess (28). The recess (28) is opened forward, backward, to lateral sides, and downward.
申请公布号 JP5707079(B2) 申请公布日期 2015.04.22
申请号 JP20100223299 申请日期 2010.09.30
申请人 パナソニック デバイスSUNX株式会社 发明人 松本 明久;山崎 直哉;田原 敬洋
分类号 B23K26/042;B23K26/00;B23K26/064;H01S3/00 主分类号 B23K26/042
代理机构 代理人
主权项
地址