| 摘要 |
In the present invention, disclosed are an apparatus and method for supporting a top substrate and a substrate bonding apparatus including the same. The apparatus for supporting the top substrate according to the present invention includes a top support plate which is provided on the top substrate, a vertical support member which is provided on both sides of the top substrate and supports the top support plate, a plurality of first to n-th vertical support bars which include absorption pads to support the upper side of the top substrate in first to n-th support positions with an absorption method, a vacuum pumping device which is connected to the first to n-th vertical support bars through an air pipe, and first to n-th control valves which are provided on the air pipe and control the vacuum state and the vacuum release state of each of the first to n-th vertical support bars. The vacuum absorption states of the first to n-th vertical support bars are successively released while performing a bonding process. The first to n-th vertical support bars are lifted on the corresponding positions through a plurality of through holes formed on the top support plate. |
