| 摘要 |
<p>A chip soldering apparatus is provided to properly pick up thin or crisp semiconductor chips for soldering by using a simple structure. The chip soldering apparatus comprises a shaft (12), wherein a soldering tool (11) for picking up the semiconductor chips for soldering is disposed on a front end of the shaft; a soldering point (50) passes through a mounting shaft (12) of a plurality of parallelly disposed flat link rods (20, 30) and rectilinearly moves along an extension direction of the shaft (12); a rod (40) disposed on the soldering tip (50) in a free rotation manner, wherein a front end (41) of the rod is connected with the shaft (12), and a rear end (43) is provided with a banlance weight (48) set to be a weight enabling a torque of a rotating shaft of the rod (40) to be balanced; and a spring (58) disposed between the soldering tip (50) and the rod (40) and provided with a push load for pressing the soldering tool to be connected with the semiconductor chips.</p> |
