| 摘要 |
PROBLEM TO BE SOLVED: To provide a method capable of obtaining film thickness information for each of zones in a substrate surface using an eddy current sensor while eliminating the effect of metal materials of an under layer of a film to be polished, and capable of determining a polishing end point of the substrate based on the film thickness information obtained.SOLUTION: A method includes: moving an eddy current sensor across a surface of a substrate during polishing of the substrate; plotting coordinates X, Y comprising resistance components X and inductive reactance components Y of impedance of the eddy current sensor onto an X-Y coordinate system; calculating a plurality of film thickness index values for each of a plurality of impedance areas by using the plurality of coordinates X, Y belonging to the respective plurality of impedance areas defined on the X-Y coordinate system; and determining a polishing end point of the substrate for each of the plurality of impedance areas by using the plurality of film thickness index values. |
