The present invention relates to a circuit board capable of internally transmitting a signal through wireless communication. For this, the circuit board according to the present invention includes an insulation layer, a first signal transmission circuit which is formed on one side of the insulation layer with a circuit pattern, and a second signal transmission circuit which is formed on the other side of the insulation layer with the circuit pattern and wirelessly transmits the signal through the resonance with the first signal transmission signal. The first and second signal transmission circuits transmit the signal in an SHF band or an EHF band.
申请公布号
KR101514596(B1)
申请公布日期
2015.04.22
申请号
KR20140009556
申请日期
2014.01.27
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
JANG, SEUNG GOO;KIM, JUNG WOO;KIM, MIN HOON;AN, YOU TAEK;SEONG, NACK GYUN