Electronic device

摘要

An electronic device includes a housing, a heat source in the housing, and a heat dissipation device in the housing and separated from the heat source by a distance. The heat dissipation device includes a casing. A heat dissipation material is disposed in the casing. The heat dissipation material includes 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material, and 15 to 20 percent volume of air. The heat dissipation device has a surface facing the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area overlaps that of the surface. An orthographic projection region on the surface is in the outer ring area. The heat dissipation device absorbs heat from the heat source through thermal radiation.

主权项

1. An electronic device, comprising:
a housing; a heat source, located inside the housing; and a heat dissipation device, disposed in the housing, the heat dissipation device and the heat source being separated by a distance, the heat dissipation device comprising a casing, a heat dissipation material being disposed in the casing, and the heat dissipation material comprising 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material, and 15 to 20 percent volume of air, wherein the phase change material comprises an alkane; wherein the casing has a surface facing the heat source, a central area and an outer ring area are defined on the surface, the outer ring area surrounds the central area, a geometric midpoint of the central area and a geometric midpoint of the surface overlap, the area of the central area is 10% to 50% of the area of the surface, an orthographic projection of the heat source to the surface forms an orthographic projection region located in the outer ring area, and the heat dissipation device absorbs heat from the heat source through thermal radiation.