发明名称 Method and system for determining and dispensing resin for a compression molding process flow
摘要 The present disclosure is directed to a system and method for forming a plurality of packaged dice on a carrier, the carrier including a storage medium configured to store an indication of a total number of unpackaged dice on the carrier. The forming includes providing a quantity of molding compound to a molding module based on the total number of the unpackaged dice on the carrier. The providing includes accessing the indication of the total number of the unpackaged dice on the carrier from the storage medium, determining the quantity of molding compound based on the indication of the total number of unpackaged dice on the carrier, and molding the unpackaged dice into the packaged dice using the quantity of molding compound.
申请公布号 US9011127(B2) 申请公布日期 2015.04.21
申请号 US201213586749 申请日期 2012.08.15
申请人 STMicroelectronics Inc. 发明人 Carino Wiljee;Ang Bernie Chrisanto;Laylo Richard
分类号 B29C39/10;B29C43/58;B29C31/00;B29C37/00 主分类号 B29C39/10
代理机构 Seed IP Law Group PLLC 代理人 Seed IP Law Group PLLC
主权项 1. A method, comprising: forming a plurality of packaged dice on a carrier, the carrier including a storage medium configured to store an indication of a total number of unpackaged dice on the carrier, the forming including: providing a quantity of molding compound to a molding module based on the total number of the unpackaged dice on the carrier, the providing including: accessing the indication of the total number of the unpackaged dice on the carrier from the storage medium;determining the quantity of molding compound based on the indication of the total number of unpackaged dice on the carrier; andmolding the unpackaged dice into the packaged dice using the quantity of molding compound.
地址 Cala Laguna PH