Leadframe, semiconductor package including a leadframe and method for producing a leadframe

摘要

A lead frame includes a die pad and a lead finger with an inner portion which is configured to be electrically connected to contact pads of a die and with an outer portion which has an attach portion. The attach portion is configured to be soldered to an external solder pad, wherein the attach portion has a width, a length and a thickness. An opening extends through the thickness of the attach portion.

主权项

1. A semiconductor package, comprising:
a lead frame comprising:
a die pad configured to accommodate a die;a lead finger comprising:
an inner portion configured to be electrically coupled to contact pads of the die; andan outer portion comprising an attach portion at an end of the lead finger facing away from the inner portion, the attach portion being configured to be soldered to an external solder pad, wherein the attach portion comprises a first width, a length and a thickness, and wherein an opening extends through the thickness of the attach portion; a die attached to the die pad and electrically coupled to the inner portion of the lead finger; and a housing encapsulating the die and the inner portion of the lead finger, wherein the outer portion of the lead finger is bent to form a gull-wing lead.