Method of direct tiling of an image sensor array

摘要

A method of making a tiled array of semiconductor dies includes aligning and flattening. One end of each semiconductor die has attached thereto a respective printed circuit board. The aligning aligns the semiconductor dies into the tiled array in such a way that the semiconductor dies rest on a vacuum plate and the one end of each die extends beyond an edge of the vacuum plate. The flattening flattens the semiconductor dies against the vacuum plate with a vacuum after the semiconductor dies are aligned.

主权项

1. A method of making a tiled array of semiconductor dies, each said die having an exposed backside, the method comprising:
aligning the semiconductor dies into the tiled array in such a way that the exposed backsides of the semiconductor dies rest on the surface of a vacuum plate; flattening the semiconductor dies against the surface of the vacuum plate with a vacuum after the semiconductor dies are aligned; sandwiching the aligned and flattened tiled array of semiconductor dies between the vacuum plate and a fiber optic plate; and affixing the aligned and flattened tiled array of semiconductor dies to the fiber optic plate.