WETTING AGENT FOR SEMICONDUCTOR USE, AND POLISHING COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a wetting agent for semiconductor use and a polishing composition which are useful for smoothing a wafer surface with high precision and suppressing the crystal defect, i.e. crystal originated particles (COP) in surface polishing of a silicon wafer.SOLUTION: A wetting agent for semiconductor use comprises a water-soluble polymer which results from an acetalization reaction between polyvinyl alcohol and an aldehyde compound having 1-7 carbon atoms; the water-soluble polymer has, in its molecule, 70-99 mol% of a vinyl alcohol structural unit and 1-30 mol% of an acetalized structural unit.