| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting device at a low cost that has high heat radiation efficiency and light emission efficiency of a semiconductor light-emitting element, that is thin, and that can control directivity of light emitted from a lateral face direction.SOLUTION: An LED chip 11 has an electrode layer 11g formed on a front face side and an electrode layer 11b formed on a rear face side, and is a double-side electrode type emitting light from a side wall surface. A lead frame 12 is bonded with the whole surface of the electrode layer 11g. A second lead frame 13 is bonded with the whole surface of the electrode layer 11b. Side parts 12a and 13a of the lead frames 12 and 13 are buried in a case 14. The LED chip 11 is sandwiched between the side parts 12a and 13a of the lead frames 12 and 13, and then, bonded and fixed. In the lead frame 12, a reflection part 12d is formed at a part obliquely opposed to the side wall surface of the LED chip 11. In the lead frame 13, a reflection part 13d is formed at a part obliquely opposed to the side wall surface of the LED chip 11. |
