| 摘要 |
<p>The present invention relates to a slurry composition. According to the present invention, the slurry composition has high viscosity at low sheer stress. Therefore, fluidity of the slurry composition is reduced so that a large amount of the slurry composition, participating in abrasion, can be uniformly distribute between a pad and a wafer. Therefore, the slurry composition can have excellent capability of removing steps and an excellent abrasion profile. Moreover, viscosity of the slurry composition is reduced as sheer stress is increased. Accordingly, induction of the slurry composition is increased so that the slurry composition can have excellent performance against flaws and scratches. The slurry composition includes: abrasion particles, an amino acid-based dispersant, nonionic compounds, and ammonium compounds.</p> |
