| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method and a substrate processing device which allow an upper surface of a substrate to be subjected to treatment using chemicals and rinse treatment without passing a step of exposing the upper surface of the substrate.SOLUTION: A chemicals paddle step (S3) of holding a liquid film of chemicals covering an upper surface of a substrate, on the upper surface while keeping a rotational speed of the substrate at zero or a low speed and a paddle rinse step (S4) of rinsing chemicals deposited on the upper surface of the substrate by holding a liquid film of DIW covering the upper surface of the substrate, on the upper surface while keeping the rotational speed of the substrate at zero or a low speed are executed in this order. The paddle rinse step is executed subsequently to the end of the chemicals paddle step, and the paddle rinse step includes a step of supplying a rise liquid to the upper surface of the substrate to substitute the liquid film of chemicals held on the upper surface of the substrate, with the rinse liquid. |
