| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic wiring board that has high product reliability by suppressing generation of cracks between via conductors constituting a via conductor group.SOLUTION: The ceramic wiring board includes: a board body; a first surface side electrode pad 24 arranged on a first surface of the board body; a second surface side electrode pad arranged on a second surface of the board body; and a via conductor group 28 comprising a plurality of via conductors 27 (27a, 27b) connecting the first surface side electrode pad 24 and the second surface side electrode pad. The via conductor group 28 comprises a plurality of outer via conductors 27a arranged on an outermost periphery, and a plurality of inner via conductors 27b surrounded by the plurality of outer via conductors 27a. As to the plurality of via conductors 27 (27a, 27b) constituting the same via conductor group 28, the outer peripheral via conductors 27 (27a, 27b) have a smaller thermal expansion coefficient difference from the board body. |
