RESIN COMPOSITION CONTAINING POLYIMIDE PRECURSOR AND METHOD FOR MANUFACTURING CURED FILM USING SAID RESIN COMPOSITION

摘要

This invention consists of the following: a resin composition that contains (a) a polyimide precursor that has a constitutional unit that can be represented by general formula (1), (b) a compound that can be represented by general formula (2), and (c) a compound that generates radicals upon exposure to active light rays; a cured film or patterned cured film formed by said resin composition; a method for manufacturing a cured film using same; and an electronic component that contains the aforementioned cured film or patterned cured film. (In formula (1), R1 represents a tetravalent organic group, R2 represents a divalent organic group, and R3 and R4 each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, or a monovalent organic group that contains a carbon-carbon unsaturated double bond.) (In formula (2), R5 represents a hydrogen atom or a C1 - 4 alkyl group and R6 represents a monovalent organic group that does not contain a (meth)acrylic group.)