半导体封装件及其制法;SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

一种半导体封装件及其制法，该半导体封装件之制法系包括：藉由黏着层将具有相对之第一作用面及第一非作用面之第一半导体晶片以其第一作用面结合至一承载件上；于该承载件上形成包覆该第一半导体晶片的包覆层；将一具有相对之第一表面及第二表面之基板以其第一表面接置于该包覆层上，且该基板之第一表面上具有复数电性连接垫；移除该承载件及黏着层，以外露出该第一半导体晶片之第一作用面；于该包覆层中形成复数贯孔，以外露出该基板的电性连接垫；以及于该包覆层上形成第一线路层，并于该贯孔中形成电性连接该第一线路层与电性连接垫的导电贯孔。本发明承载件能有效克服知制程中翘曲之问题，且能降低成本。; forming a cladding layer on the carrier member for cladding the first semiconductor wafer; connectively disposing a substrate that has opposite a first surface and a second surface on the cladding layer through the first surface, in which the first surface of the substrate has a plurality of electrical connection pads; removing the carrier member and the adhesion layer for exposing out the first acting plane of the first semiconductor wafer; forming a plurality of through-holes in the cladding layer for exposing out the electrical connection pads of the substrate; and forming a first line layer on the cladding layer, and forming conductive through-holes that electrically connect the first line layer with the electrical connection pads in the through-holes. The carrier member of the present invention can effectively overcome a conventional issue of the warpage in the manufacturing process and reduce costs.