| 摘要 |
Provided is a photosensitive thermosetting resin composition which has excellent workability, processing accuracy and reliability such as impact resistance and bendability, and is suitable for an insulating film of a flexible printed wiring board, especially for a one-time formation process of a folding portion and a mounting portion. A photosensitive thermosetting resin composition which contains an alkali soluble resin having an imide ring, an oxime ester-based photobase generator having a group represented by general formula (I), and a thermosetting component. In general formula (I), R1 represents a hydrogen atom, an unsubstituted or substituted phenyl group, an unsubstituted or substituted alkyl group, an alkyl group that is interrupted by one or more oxygen atoms, an unsubstituted or substituted cycloalkyl group, an unsubstituted or substituted alkanoyl group or a benzoyl group; and R2 represents an unsubstituted or substituted phenyl group, an unsubstituted or substituted alkyl group, an alkyl group that is interrupted by one or more oxygen atoms, an unsubstituted or substituted cycloalkyl group, an unsubstituted or substituted alkanoyl group or a benzoyl group. |
