| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mold underfill material excellent in repletion.SOLUTION: A semiconductor element arranged on a substrate is sealed, and the clearance between the substrate and the semiconductor element is filled with a mold underfill material for compression molding. The underfill material comprises an epoxy resin (A), a hardening agent (B) and an inorganic filler (C), is a granule and has a time T(5) for reaching 5% of a maximum torque from the start of measurement of 25-100 s, measured at the mold temperature of 175°C by using a curastometer.</p> |
