SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATE PLATE INCLUDING THE SAME, PRINTED CURCUIT BOARD USING THE SAME, AND METHOD FOR MANUFACTURING THE SAME

摘要

Disclosed herein are a surface-treated copper foil, a copper-clad laminate plate including the same, a printed circuit board using the same, and a method for manufacturing the same. In detail, the copper-clad laminate plate according to one implementation embodiment of the present invention includes: carrier; a peel layer formed on the carrier; a copper-clad layer formed on the peel layer; and a surface-treated layer formed on the copper-clad layer, in which the surface-treated layer includes a thiol-based compound. Therefore, the present invention provides a printed circuit board capable of improving an adhesive force between a base and a copper-clad layer without treating a roughed surface by forming the surface-treated layer on the copper-clad layer.

主权项

1. A surface-treated copper foil, comprising:
a copper-clad layer; and a surface-treated layer formed on the copper-clad layer.