发明名称 |
Solderless mounting for semiconductor lasers |
摘要 |
A first contact surface (310) of a semiconductor laser chip (302) can be formed to a first target surface roughness and a second contact surface (312) of a carrier mounting (304) can be formed to a second target surface roughness. A first bond preparation layer (306) comprising a first metal can optionally be applied to the formed first contact surface, and a second bond preparation layer (308) comprising a second metal can optionally be applied to the formed second contact surface. Both preparation layers may be made of gold and diffusion bonding results from a heating of device under pressure. The first contact surface can be contacted with the second contact surface, and a solderless securing process can secure the semiconductor laser chip to the carrier mounting. Related systems, methods, articles of manufacture, and the like are also described. |
申请公布号 |
AU2013334609(A1) |
申请公布日期 |
2015.04.16 |
申请号 |
AU20130334609 |
申请日期 |
2013.10.23 |
申请人 |
SPECTRASENSORS, INC. |
发明人 |
FEITISCH, ALFRED;NEUBAUER, GABI;SCHREMPEL, MATHIAS |
分类号 |
H01S5/022;B23K20/02;H01S5/024;H01S5/042 |
主分类号 |
H01S5/022 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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