发光二极体之封装元件的制造方法及封装结构;METHOD OF MANUFACTURING PACKAGE COMPONENT FOR LIGHT EMITTING DIODE AND PACKAGE STRUCTURE THEREOF

摘要

本发明系揭露一种发光二极体之封装元件的制造方法，至少包括：将设置于基板上之至少一发光二极体置入光固化树脂中，其中基板与光固化树脂完全包覆发光二极体；提供电力予发光二极体以令发光二极体发出复数道光线，使得部分之光固化树脂受到光线的照射而固化，以形成公模；进行分离程序，以将公模与光固化树脂之另一部分、发光二极体及基板分离；进行翻模程序以利用公模制造母模，其中母模具有与公模之形状相同的至少一容纳空间；以及进行成型程序以利用容纳空间形成与公模之形状相同的封装元件。; providing a power to the light emitting diode to make the light emitting diode emit a plurality of light beams such that a portion of the photocuring resin is cured by the light beams to obtain a male mold; performing a separation process to separate the male mold and the other portion of the photocuring resin, the light emitting diode and the substrate; performing a rollover process to manufacture the female mold by the male mold, wherein the female mold has at least one accommodation space with a shape identical to that of the male mold; and performing a forming process to form a package component with a shape identical to that of the male mold.