| 摘要 |
A semiconductor module (2) is provided with: a first semiconductor element (31), which has a first signal electrode (41) that is formed on a surface (33); a second semiconductor element (32), which is disposed by being spaced apart from the first semiconductor element (31), and which has a second signal electrode (42) that is formed on a surface (33) on the first semiconductor element side; a first signal lead (51) that is electrically connected to the first signal electrode (41); and a second signal lead (52) that is electrically connected to the second signal electrode (42). The first signal lead (51) and the second signal lead (52) are disposed such that height positions thereof match each other in the direction toward the second semiconductor element (32) from the first semiconductor element (31). |
