| 发明名称 |
EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEALED USING SAME |
| 摘要 |
The present invention relates to an epoxy resin composition for sealing a semiconductor device and to a semiconductor device sealed using same, wherein the composition includes an epoxy resin, a hardening agent, an inorganic filler, and a hardening catalyst, and the hardening catalyst includes the compound of Chemical Formula 1 below. |
| 申请公布号 |
WO2015053453(A1) |
申请公布日期 |
2015.04.16 |
| 申请号 |
WO2014KR03845 |
申请日期 |
2014.04.30 |
| 申请人 |
CHEIL INDUSTRIES INC. |
发明人 |
KIM, MIN GYUM;LEE, DONG HWAN;KIM, JUNG SEOB;CHEON, JIN MIN;CHEON, HWAN SUNG |
| 分类号 |
C08L63/00;C08G59/18;C08K3/00;C08K5/56 |
主分类号 |
C08L63/00 |
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