| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat sink which is easy to manufacture, and has a large attachment area of cooling objects, such as semiconductors, and has excellent mass productivity allowing for easy attachment of the cooling objects. <P>SOLUTION: An element 7 is made up of a dish-like plate 3 having a communication hole 2 at one end of the bottom thereof; an inner fin 4 inserted into the dish-like plate 3; and a flat base plate 6 stacked on the dish-shaped plate 3. A pair of the elements 7 are laminated one upon another so as to connect their respective dish-shaped plates 3 in a back-to-back manner. Then, cooling objects 8 are respectively connected to the base plates 6, and cooling water is flown in a "U" shape into the inside of the elements 7, thereby performing heat exchange between the cooling water and the cooling objects 8. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
