| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power module substrate, a power module substrate with a heat sink, a power module and a power module substrate manufacturing method, which can effectively radiate heat from an electronic component and the like mounted on a circuit layer and inhibit an occurrence of cracks in an insulation substrate under a cooling/heating cycle load. <P>SOLUTION: A power module substrate 10 comprises: an insulation substrate 11; a circuit layer 12 formed on one surface of the insulation substrate 11; and a metal layer 13 formed on another surface of the insulation substrate 11. The circuit layer 12 is composed of a copper plate bonded to the one surface of the insulation substrate 11. The metal layer 13 is composed of an aluminum plate bonded to the other surface of the insulation substrate 11. The copper plate composing the circuit layer 12 has a composition containing, before being bonded, either one of at least one element of a total amount of not less than 1 molppm to not more than 100 molppm among an alkaline earth element, a transition metal element and a rare earth element, or boron of not less than 100 molppm to not more than 1000 molppm, in which the balance is copper and incidental impurities. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
