| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent peeling and breaking of a surface layer, in a semiconductor device in which a via hole is formed in a substrate and the surface layer. <P>SOLUTION: A semiconductor device comprises: a substrate 10; a surface layer 20 that is provided on the substrate 10 and is composed of a different material than that of the substrate 10; and an electrode pad 50 provided on the surface layer 20. A via hole 30 is formed in the substrate 10 and the surface layer 20. In the via hole 30, a metal layer 32 electrically connected to the electrode pad 50 is provided. Around the opening of the via hole 30, a groove 22 is formed in the surface layer 20 so as to surround the via hole 30. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
