| 摘要 |
<p>An imaging device (21) includes: a photoelectric conversion layer (25) in which photoelectric conversion devices that convert received light into charge are arranged in a planar fashion; and a conductor structure layer (24) provided on an upper surface or a lower surface of the photoelectric conversion layer (25) and formed by stacking plural conductor layers (29-1,29-2) having conductor metals (28-1,28-2) with concavo-concave structures at predetermined periodic intervals within a plane in parallel to light receiving surfaces of the photoelectric conversion devices.</p> |
