| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can improve connection reliability with a wiring board. <P>SOLUTION: Manufacturing of a semiconductor device comprises: forming grooves 18 each having a predetermined width by a dicing saw 17 on a frame part 13 of a lead frame 11 encapsulated by an encapsulation resin 15 along dicing lines 16 from an undersurface 132 side of the frame part 13; subsequently, forming plating layers 19 on bottom faces 181 and lateral faces 183 of the grooves 18, on undersurfaces 32 of die pads 3 and undersurfaces 142 of the leads 14; removing the frame part 13 and encapsulation resin 15 in a penetrating manner along the dicing lines 16 by using a dicing saw 20 having a width narrower than a width of the groove 18. As a result, pieces of the semiconductor devices 1 each having a lead plating layer 10 formed on an inner end face 832 of a body part 8 of the lead 4 can be obtained. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
