| 摘要 |
<p>A sealant capable of tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The sealant for sealing a device comprises a copolyami de-series resin powder having a particle diameter of not more than 1 mm. The copolyamide- series resin powder contains at least a fine particle (e.g., a copolyamide-series resin particle having an average particle diameter of 20 to 400 µm), or may contain the fine particle in combination with a coarse particle (e.g., a copolyamide-series resin particle having an average particle diameter of 450 to 800 µm). The copolyamide-series resin may be a crystalline resin. The copolyamide-series resin may have a melting point or softening point of 75 to 160°C. The copolyamide-series resin maybe, e.g., abinaryorternarycopolymer. Further, the copolyamide-series resin may contain a unit derived from a long-chain component having a C 8-16 alkylene group (at least one component selected from the group consisting of a C 9-17 lactam and an aminoC 9-17 alkanecarboxylic acid) .</p> |
