| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive for flip-chip mounting which has excellent coatability, high bonding reliability, and high transparency and facilitates recognition of a pattern or a position display when a semiconductor chip is bonded using a camera, and to provide an adhesive film for flip-chip mounting which is produced using the adhesive for flip-chip mounting, and a mounting method of a semiconductor chip using the adhesive film for flip-chip mounting. <P>SOLUTION: The adhesive for flip-chip mounting contains an epoxy resin, an inorganic filler and a hardener. The inorganic filler is subjected to surface treatment with a silane coupling agent and has an average particle size of 0.05-0.20μm, and the content of the inorganic filler in the adhesive for flip-chip mounting is 20-60 wt.%. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
