发明名称 Electronic module
摘要 An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.
申请公布号 US9007776(B2) 申请公布日期 2015.04.14
申请号 US201213714424 申请日期 2012.12.14
申请人 HTC Corporation 发明人 Chuang I-Cheng;Chen Chien-Hung;Li Chih-Hung;Chen Cheng-Te
分类号 H05K7/00;G06F1/16;H04M1/00;H05K1/02;H05K1/14;H04M1/02 主分类号 H05K7/00
代理机构 Jianq Chyun IP Office 代理人 Jianq Chyun IP Office
主权项 1. An electronic module comprising: a first circuit board having a first surface; a plurality of first electronic components located on the first surface of the first circuit board; a first conductive fence located on the first surface of the first circuit board, the first conductive fence enclosing the first electronic components and having a first opening exposing the first electronic components; a second circuit board having a second surface; a plurality of second electronic components located on the second surface of the second circuit board; and a second conductive fence located on the second surface of the second circuit board, the second conductive fence enclosing the second electronic components and having a second opening exposing the second electronic components, the first opening of the first conductive fence jointing the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence, wherein at least one of the first electronic components is higher than the first conductive fence, and each of the first conductive fence and the second conductive fence is an integrally-formed metal frame, respectively.
地址 Taoyuan TW