发明名称 |
Semiconductor device and method for manufacturing thereof |
摘要 |
In a semiconductor device including a transistor using an oxide semiconductor film, stable electric characteristics can be provided and high reliability can be achieved. A structure of the semiconductor device, which achieves high-speed response and high-speed operation, is provided. In a semiconductor device including a transistor in which an oxide semiconductor film, a gate insulating film, and a gate electrode layer are stacked in order and a sidewall insulating layer is provided on the side surface of the gate electrode layer, the sidewall insulating layer has an oxygen-excess regions, which is formed in such a manner that a first insulating film is formed and then is subjected to oxygen doping treatment, a second insulating is formed over the first insulating film, and a stacked layer of the first insulating film and the second insulating film are etched. |
申请公布号 |
US9006733(B2) |
申请公布日期 |
2015.04.14 |
申请号 |
US201313741481 |
申请日期 |
2013.01.15 |
申请人 |
Semiconductor Energy Laboratory Co., Ltd. |
发明人 |
Yamazaki Shunpei |
分类号 |
H01L29/10;H01L29/78;H01L29/66;H01L29/786;H01L27/12 |
主分类号 |
H01L29/10 |
代理机构 |
Fish & Richardson P.C. |
代理人 |
Fish & Richardson P.C. |
主权项 |
1. A semiconductor device comprising:
an oxide semiconductor film provided over an oxide insulating film and including a channel formation region; a gate insulating film over the oxide semiconductor film; a gate electrode layer over the gate insulating film; a sidewall insulating layer including a first insulating film and a second insulating film; a third insulating film over and in contact with the gate electrode layer; and a source electrode layer and a drain electrode layer which are electrically connected to the oxide semiconductor film, wherein the sidewall insulating layer has an oxygen-excess region, wherein the first insulating film is in contact with a part of a top surface of the gate insulating film and side surfaces of the gate electrode layer and the third insulating film, and wherein the second insulating film is in contact with a top surface and a side surface of the first insulating film. |
地址 |
Kanagawa-ken JP |