发明名称 Semiconductor device and method for manufacturing thereof
摘要 In a semiconductor device including a transistor using an oxide semiconductor film, stable electric characteristics can be provided and high reliability can be achieved. A structure of the semiconductor device, which achieves high-speed response and high-speed operation, is provided. In a semiconductor device including a transistor in which an oxide semiconductor film, a gate insulating film, and a gate electrode layer are stacked in order and a sidewall insulating layer is provided on the side surface of the gate electrode layer, the sidewall insulating layer has an oxygen-excess regions, which is formed in such a manner that a first insulating film is formed and then is subjected to oxygen doping treatment, a second insulating is formed over the first insulating film, and a stacked layer of the first insulating film and the second insulating film are etched.
申请公布号 US9006733(B2) 申请公布日期 2015.04.14
申请号 US201313741481 申请日期 2013.01.15
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Yamazaki Shunpei
分类号 H01L29/10;H01L29/78;H01L29/66;H01L29/786;H01L27/12 主分类号 H01L29/10
代理机构 Fish & Richardson P.C. 代理人 Fish & Richardson P.C.
主权项 1. A semiconductor device comprising: an oxide semiconductor film provided over an oxide insulating film and including a channel formation region; a gate insulating film over the oxide semiconductor film; a gate electrode layer over the gate insulating film; a sidewall insulating layer including a first insulating film and a second insulating film; a third insulating film over and in contact with the gate electrode layer; and a source electrode layer and a drain electrode layer which are electrically connected to the oxide semiconductor film, wherein the sidewall insulating layer has an oxygen-excess region, wherein the first insulating film is in contact with a part of a top surface of the gate insulating film and side surfaces of the gate electrode layer and the third insulating film, and wherein the second insulating film is in contact with a top surface and a side surface of the first insulating film.
地址 Kanagawa-ken JP